1. What is an IC carrier board

The full name of IC carrier board is IC Package Substrate, which is a key carrier in the packaging and testing process. It is used to establish signal connections between IC and PCB, and can also protect circuits, fix circuits, and dissipate waste heat.

2. Types of IC carrier boards

According to the packaging method, IC substrates can be divided into BGA packaging substrates, CSP packaging substrates, FC packaging substrates, and MCM packaging substrates.

BGA packaging substrate

Technical advantages: significantly increasing chip pins, performing well in chip heat dissipation and electrical performance.

Application field: Suitable for IC packages with more than 300 pins.

CSP packaging substrate

Technical advantages: single-chip packaging, light weight, small size.

Application areas: Used in memory products, telecommunications products, and electronic products with a small number of pins.

FC packaging substrate

Technical advantages: By flipping the chip packaging, it has low signal interference, low circuit loss, good performance, and effective heat dissipation.

Application areas: Widely used in products such as CPUs, GPUs, Chipsets, etc.

MCM packaging substrate

Technical advantage: Absorb chips with different functions into one package. This type of substrate has the characteristics of being lightweight, thin, short, and compact, but due to multiple chips being packaged in one package, it performs poorly in terms of signal interference, heat dissipation, and fine wiring.

Application areas: Applied in military and aerospace fields.

According to different packaging materials, IC carrier boards can be divided into hard packaging substrates, flexible packaging substrates, and ceramic packaging substrates.

(1) Hard substrate

Main materials and application areas: BT (MEMS, communication and memory chips, LED chips), ABF (applied to a large number of high-end chips such as CPUs, GPUs, and chipsets), MIS (applied to markets such as analog, power ICs, and digital currencies).

(2) Flexible substrate

Main materials and application areas: PI, PE (applied in automotive electronics, consumer electronics, as well as military fields such as launch vehicles, cruise missiles, and space satellites).

(3) Ceramic substrate

Main materials and application areas: alumina, aluminum nitride, silicon carbide (used in semiconductor lighting, laser and optical communication, aerospace, automotive electronics, deep-sea drilling and other fields).

According to the application field, IC substrates can be divided into storage chip packaging substrates, microelectromechanical system packaging substrates, RF module packaging substrates, processor chip packaging substrates, and high-speed communication packaging substrates.

(1) Memory chip packaging substrate (eMMC) is mainly used for storage modules, solid-state drives, etc. in smartphones and tablets.

(2) Micro electromechanical system packaging substrate (MEMS) is mainly used for sensors in smartphones, tablets, wearable electronic products, etc.

(3) RF module packaging substrate (RF) is mainly used for RF modules in mobile communication products such as smartphones.

(4) The WB-CSP processor chip is mainly used for baseband and application processors in smartphones, tablets, and other devices.

(5) The FC-CSP processor chip is mainly used for baseband and application processors in smartphones, tablets, and other devices.

(6) High speed communication packaging substrate, mainly used for conversion modules in data broadband, telecommunications, FTTX, data centers, security monitoring, and smart grids.