With the gradual development of consumer electronic products towards lighter, thinner, and more intelligent applications, higher requirements have been put forward for display technology and data transmission processing capabilities. The diversification of applications and the thinning of volume have also prompted printed circuit boards to arrange more wires in limited areas, continuously developing towards ultra-fine directions such as fine line width, dense wiring, and precise craftsmanship. High density, thinness, flexibility, rigid flexible combination, and environmentally friendly production have gradually become the direction of future development.

HDI stands for High Density Interconnector, which is a technology used in the production of printed circuit boards. It is a type of circuit board with a relatively high distribution density using micro blind buried hole technology. HDI is a compact product designed specifically for small capacity users.

Non-PTFE, low loss, low tolerance, and excellent high-frequency performance, stable electrical characteristics at various frequencies, low dielectric constant temperature coefficient, low Z-axis thermal expansion coefficient, low in-plane expansion coefficient, superior dimensional stability, and easy mass production.