Generally, there are electroplated copper substrates, silver plated copper substrates, tin sprayed copper substrates, and anti-oxidation copper substrates. The copper substrate circuit layer requires a high current carrying capacity, so thicker copper foil should be used, with a thickness generally ranging from 35 μ m to 280 μ m; The thermal insulation layer is the core technology of copper substrates. The core thermal components are composed of aluminum oxide and silicon powder, as well as polymer filled with epoxy resin. It has a low thermal resistance (0.15), excellent viscoelastic properties, and the ability to resist thermal aging, and can withstand mechanical and thermal stress.

Thick copper plates have significant advantages in carrying high currents, good heat dissipation, and reducing thermal strain, greatly reducing the risk of board burning and making them an excellent option for high current PCB design. In addition, thick copper plates can also increase the mechanical strength of circuit boards and reduce the volume of end products.

The main purpose of thickened copper plating is to ensure that there is a sufficiently thick copper coating inside the hole, ensuring that the resistance value is within the range required by the process. As a plug-in component, it is used to fix the position and ensure the connection strength; As a surface encapsulated device, some holes only serve as conductive holes, playing a role in conducting electricity on both sides.