Generally, there are electroplated copper substrates, silver plated copper substrates, tin sprayed copper substrates, and anti-oxidation copper substrates. The copper substrate circuit layer requires a high current carrying capacity, so thicker copper foil should be used, with a thickness generally ranging from 35 μ m to 280 μ m; The thermal insulation layer is the core technology of copper substrates. The core thermal components are composed of aluminum oxide and silicon powder, as well as polymer filled with epoxy resin. It has a low thermal resistance (0.15), excellent viscoelastic properties, and the ability to resist thermal aging, and can withstand mechanical and thermal stress. The copper substrate metal base is the supporting component of the copper substrate, which requires high thermal conductivity. Generally, copper plates can also be used (among which copper plates can provide better thermal conductivity), suitable for conventional mechanical processing such as drilling, punching and cutting.

PCB board layers: 2L

PCB board material: copper substrate

PCB board thickness: 3mm

Copper thickness: 1Oz

Character: Black

Surface treatment: nickel plating/tapping teeth

Minimum aperture: 2.4mm

Solder mask type: white oil

Delivery deadline: Samples can be sent out within 12 hours at the fastest, and shipments can be made within 3-5 days