The thermal conductivity of copper based materials is twice that of aluminum based materials. The higher the thermal conductivity, the higher the thermal conductivity efficiency and the better the heat dissipation performance.

Copper based materials can be processed into metalized holes, while aluminum based materials cannot. The network of metalized holes must be the same, so that the signal has good grounding performance. Secondly, copper itself has weldability, making it possible to choose welding for the final installation of the designed structural components.

The copper base of the copper substrate can be etched into fine patterns and processed into a convex shape. Components can be directly attached to the convex surface to achieve excellent grounding and heat dissipation effects;

Due to the difference in elastic modulus between copper and aluminum (copper has an elastic modulus of approximately 121000 MPa, while aluminum has an elastic modulus of 72000 MPa), the corresponding warpage and shrinkage of copper substrates are smaller than those of aluminum substrates, resulting in more stable overall performance.

Rules for copper substrate design: Due to the thickness of the copper substrate, the minimum drilling tool diameter must be 0.4mm, and the line width spacing is determined by the thickness of the copper foil on the copper substrate. The thicker the copper foil, the wider the required minimum line width and the larger the required minimum spacing.

PCB board layers: 2L

PCB board material: copper substrate 8W

PCB board thickness: 1.6mm

Copper thickness: 2Oz

Character: Black

Surface treatment: OSP

Minimum aperture: 0.3mm

Solder mask type: white oil

Delivery deadline: Samples can be sent out within 12 hours at the fastest, and shipments can be made within 3-5 days

Features: High heat dissipation performance

PCB power supply copper substrate 8W application areas: heat sink, igniter, power supply